Release Film Markets & Applications
This non stickiness polymethylpentene film can be used in a wide variety of applications.
Heat Resistant Release Film for Flex Circuits and Rigid-flex Circuits
Due to the excellent balance between heat resistance and releasability and its conformity to complex patterns, Opulent™ has been favorably accepted as release film for flex circuits.
In flex circuit manufacturing process, the release film can be used in the cover lay film bonding or stiffener bonding process.
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Release Film for Advanced Composite Material (ACM)
Release Film for Semiconductor Encapsulation
Release Film in Advanced Technology Materials Manufacturing