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Home » TPX™ Film Opulent™ Applications
TPX™ Film Opulent™ Applications

Release Film Markets & Applications
This non stickiness polymethylpentene film can be used in a wide variety of applications.

Heat Resistant Release Film for Flex Circuits and Rigid-flex Circuits
Due to the excellent balance between heat resistance and releasability and its conformity to complex patterns, Opulent™ has been favorably accepted as release film for flex circuits.

In flex circuit manufacturing process, the release film can be used in the cover lay film bonding or stiffener bonding process.

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Release Film for Advanced Composite Material (ACM)

Release film for Advanced Composite Material (ACM) ACM is a composite material with excellent mechanical strength and heat resistance. In the ACM manufacturing process Opulent is used as a release film when the prepreg of carbon fiber, aramid fiber, and epoxy resin is cured.

Release Film for Semiconductor Encapsulation

Release Film for Semiconductor Encapsulation Opulent is used as a release film when semiconductors are encapsulated with a thermosetting resin and cured.

Release Film in Advanced Technology Materials Manufacturing

Release film in Advanced Technology Materials Manufacturing Opulent can be used for various industrial fields such as solar where releasability and heat resistance is required in the manufacture of advanced technology materials.

 

 

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A lightweight, impact resistant alternative to high index glass, this thiourethane, 2- or 3-component system is thermally cured to form a hard, durable, transparent high refractive index plastic, and can be cast into sheets, films, blocks, or prisms.

TPX™ Polymethylpentene (PMP)

A transparent, heat resistant, 4-methylpentene-1 based polyolefin resin for release-films, LED molds, and for food and cosmetic packaging.

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