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ICROS™ Thin Grinding Tapes

The ICROS™ thin wafer backgrinding tape line features special anti-warpage properties that significantly flattens the wafer. This tape has a warpage of 2mm versus 26mm for conventional tape which reduces risk of wafer breakage during handling and transportation. In addition, the super clean adhesive is designed to eliminate the rinse process.

Superior TTV
Hard type base film to support extra thin wafers
Anti-warpage properties
No residue after removal
High temperature capable
Easy detaping
Low Taping Tension to Reduce Wafer Warpage
              → 'New Easy Peel-off Liner' PB type





 Proposal (De-taping Process)




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