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ICROS™ Bumped Wafer Tapes

Gold Bumped Wafer Tape for 20-30um Bump Height

The ICROS™ bumped wafer tape is the best solution for gold bumped wafers. The ICROS™ bumped wafer tape features a soft adhesive for good bump absorption to prevent water penetration and wafer breakage.

Gold Bumped Wafer Tape for 20-30um Bump Height

Superior TTV

 

Soft adhesive provides for good bump absorption
High cohesive strength and high molecular weight will result in
      no residue after removal
Low ionic impurities

Pillar Bumped Wafer Tape for 40-100um Bump Height

The ICROS bumped wafer tape is the best solution for medium bump such as Pb and Cu pillar bump. It features a special resin middle layer for good bump absorption. Thin adhesive layer to prevent water penetration and wafer breakage.

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Superior TTV


Soft intermediate layer provides for good bump
     absorption
No residue after removal
Low ionic impurities
UV type adhesive available

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Solder Bumped Wafer Tape for 100-150um Bump Height

The ICROS™ bumped wafer tape is the best solution for high bumped wafers such as solder bump. It features a special resin middle layer for good bump absorption. Thin adhesive layer to prevent water penetration and wafer breakage.

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Superior TTV


Soft intermediate layer provides for good bump
     absorption
Low ionic impurities
Low adhesive strength after UV irradiation makes
     detaping easy

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Solder Bumped Wafer Tape for 150+um Bump Height

The ICROS™ bumped wafer tape is the best solution for super high bumped wafers such as solder bump. It features a special resin middle layer for good bump absorption. Thin adhesive layer to prevent water penetration and wafer breakage.

image
Superior TTV


Special resin layer transforms to bump shape providing
     good bump absorption
Low ionic impurities
Both Non-UV and UV types adhesive available

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