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Home » ICROS™ Tape

ICROS™ TAPE is a surface protective tape used in silicon wafer back-grinding process for the manufacturer of integrated circuits.

ICROS™ Tape Outstanding Features

  • Super softness
  • No contamination
  • Uniform thickness


  • Two US patents (4853286 & 4928438)
  • Japan Patent (1563284)
  • Korea Patent (34757)



  • Mitsui Chemicals offers solutions for every backgrinding application:

Conventional Tapes

Bumped Wafer Tapes
      Gold bump (20-30um bump height)
      Pillar Bump (40-100um bump height)
      Solder Bump (100-150um bump height)
      Solder bump (150um+ bump height)

Thin Grinding Tapes

Chemical Resistant / Heat Resistant Tape

No Rinse Process- For Thin Wafer Grinding

ICROS Tape can be processed using a "no rinse" process, which is shorter than conventional processing methods resulting in lower production costs and minimum wafer breakage


 NO RINSE PROCESS customers : OVER 40 in the world
[ For thin wafer grinding : No Rinse process ]


The consistency in its wafer thickness after back grinding and minimal wafer breakage are only two of the attributes that contribute to its reputation and reliability.


Related Products

Pellicle Dust Proof Membrane

Dust proof membrane.

Specialty and Semiconductor Gases

Monosilane, Disilane, and Silicon Tetrafluoride.

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