ICROS™ TAPE is a surface protective tape used in silicon wafer back-grinding process for the manufacturer of integrated circuits.

ICROS™ Tape Outstanding Features

• Super softness
• No contamination
• Uniform thickness

Patents

• Two US patents (4853286 & 4928438)
• Japan Patent (1563284)
• Korea Patent (34757)

• Mitsui Chemicals offers solutions for every backgrinding application:

Conventional Tapes
      Non-UV
      UV

Bumped Wafer Tapes
      Gold bump (20-30um bump height)
      Pillar Bump (40-100um bump height)
      Solder Bump (100-150um bump height)
      Solder bump (150um+ bump height)

Thin Grinding Tapes

Chemical Resistant / Heat Resistant Tape

No Rinse Process- For Thin Wafer Grinding

ICROS Tape can be processed using a "no rinse" process, which is shorter than conventional processing methods resulting in lower production costs and minimum wafer breakage

 NO RINSE PROCESS customers : OVER 40 in the world
[ For thin wafer grinding : No Rinse process ]

The consistency in its wafer thickness after back grinding and minimal wafer breakage are only two of the attributes that contribute to its reputation and reliability.