This non stickiness polymethylpentene film can be used in a wide variety of release film markets and applications.

Due to the excellent balance between heat resistance and releasability and its conformity to complex patterns, Opulent™ has been favorably accepted as release film for flex circuits.

In flex circuit manufacturing process, the release film can be used in the cover lay film bonding or stiffener bonding process.

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ACM is a composite material with excellent mechanical strength and heat resistance. In the ACM manufacturing process Opulent is used as a release film when the prepreg of carbon fiber, aramid fiber, and epoxy resin is cured.

Opulent is used as a release film when semiconductors are encapsulated with a thermosetting resin and cured.

Opulent can be used for various industrial fields such as solar where releasability and heat resistance is required in the manufacture of advanced technology materials.