ICROS® Super Soft Surface Protective Tape

The super soft protective tape of the ICROS® Tape line of backgrinding wafer tape conforms to absorb topography of bumps to prevent wafers from damage and dimpling yielding excellent TTV after backgrinding. The Super Soft Tape optimizes softness to achieve good absorption of shock and vibration during processing. In addition, the super soft adhesive is designed to eliminate the rinse process.