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The super flat protective tape of the ICROS® backgrinding wafer tape line features special anti-warpage properties that significantly flattens the wafer. The Super Flat Tape has a warpage of 2mm versus 26mm for conventional tape. The flatness of this type of surface protective tape reduces risk of wafer breakage during handling and transportation. In addition, the super clean adhesive is designed to eliminate the rinse process.

Mechanism

Proposal (De-taping Process)


