| The super flat protective tape of the ICROS®
Tape line of backgrinding wafer tape features special anti-warpage properties
that significantly flattens the wafer. The Super Flat Tape has a warpage of 2mm
versus 26mm for conventional tape. The flatness of this type of surface protective
tape reduces risk of wafer breakage during handling and transportation. In addition,
the super clean adhesive is designed to eliminate the rinse
process.
Mechanism

Proposal
(De-taping Process)

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