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ICROS® TAPE is used to manufacture integrated circuits as a surface protective tape in the silicon wafer back-grinding process. Since this backgrinding wafer tape uses special adhesives which hardly transfer to the wafer surface, it can reduce production costs and eliminate environmental problems by dispensing with organic washing solvents.

Characteristics of this backgrinding wafer tape make it ideal for use in manufacturing integrated circuits as a surface protective tape in the silicon wafer back-grinding process.
| Low contamination | Simple water rinsing | ||
| Superb softness | Minimizes wafer breakage | ||
| Uniform thickness | Precise wafer thickness after back-grinding |
Mitsui Chemicals offers three types of surface protective tape:
Super Flat Surface Protective Tape
Super Soft Surface Protective Tape
Heat Resistant Surface Protective Tape
ICROS Tape can be processed using a "no rinse" process, which is shorter than conventional processing methods resulting in lower production costs and minimum wafer breakage.

NO RINSE PROCESS customers : OVER 40 in the world
[ For thin wafer grinding : No Rinse process ]
The consistency in its wafer thickness after back grinding and minimal wafer breakage are only two of the attributes that contribute to its reputation and reliability.

