| ICROS® TAPE is used to manufacture integrated
circuits as a surface protective tape in the silicon wafer back-grinding process.
Since this backgrinding wafer tape uses special adhesives which hardly transfer
to the wafer surface, it can reduce production costs and eliminate environmental
problems by dispensing with organic washing solvents.
Characteristics of this backgrinding wafer tape make it ideal for use in manufacturing
integrated circuits as a surface protective tape in the silicon wafer back-grinding
process.
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Low contamination |
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Simple water rinsing |
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Superb softness |
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Minimizes wafer breakage |
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Uniform thickness |
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Precise wafer thickness after back-grinding |
Mitsui Chemicals offers three types of surface protective tape:
Super
Flat Surface Protective Tape
Super
Soft Surface Protective Tape
Heat
Resistant Surface Protective Tape
ICROS Tape can be processed using a "no rinse" process, which is
shorter than conventional processing methods resulting in lower production costs
and minimum wafer breakage.
NO RINSE PROCESS customers : OVER 40 in the world
[ For thin wafer grinding : No Rinse process ]
View
Example
The consistency in its wafer thickness after back grinding and minimal wafer
breakage are only two of the attributes that contribute to its reputation and
reliability.
Contact the product manager for more information on this backgrinding
wafer tape and its current and potential end uses.
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