ICROS™ TAPE is a surface protective tape used in silicon wafer back-grinding process for the manufacturer of integrated circuits.
ICROS™ Tape Outstanding Features
- Super softness
- No contamination
- Uniform thickness
Patents
- Two US patents (4853286 & 4928438)
- Japan Patent (1563284)
- Korea Patent (34757)
Mitsui Chemicals offers solutions for every backgrinding application:
- Bumped Wafer Tapes
- Gold bump (20-30um bump height)
- Pillar Bump (40-100um bump height)
- Solder Bump (100-150um bump height)
- Solder bump (150um+ bump height)
- Chemical Resistant / Heat Resistant Tape
No Rinse Process- For Thin Wafer Grinding
ICROS Tape can be processed using a "no rinse" process, which is shorter than conventional processing methods resulting in lower production costs and minimum wafer breakage.
NO RINSE PROCESS customers : OVER 40 in the world
[ For thin wafer grinding : No Rinse process ]
The consistency in its wafer thickness after back grinding and minimal wafer breakage are only two of the attributes that contribute to its reputation and reliability.
GLOBAL SITE