ICROS® TAPE

ICROS® TAPE is used to manufacture integrated circuits as a surface protective tape in the silicon wafer back-grinding process. Since this backgrinding wafer tape uses special adhesives which hardly transfer to the wafer surface, it can reduce production costs and eliminate environmental problems by dispensing with organic washing solvents.

ICROS® Surface Protective Tape Characteristics

Characteristics of this backgrinding wafer tape make it ideal for use in manufacturing integrated circuits as a surface protective tape in the silicon wafer back-grinding process.

	Low contamination		Simple water rinsing
	Superb softness		Minimizes wafer breakage
	Uniform thickness		Precise wafer thickness after back-grinding

Mitsui Chemicals offers three types of surface protective tape:

Super Flat Surface Protective Tape
Super Soft Surface Protective Tape
Heat Resistant Surface Protective Tape

No Rinse Process - For thin Wafer Grinding

ICROS Tape can be processed using a "no rinse" process, which is shorter than conventional processing methods resulting in lower production costs and minimum wafer breakage.

NO RINSE PROCESS customers : OVER 40 in the world
[ For thin wafer grinding : No Rinse process ]

View Example

The consistency in its wafer thickness after back grinding and minimal wafer breakage are only two of the attributes that contribute to its reputation and reliability.

Contact the product manager for more information on this backgrinding wafer tape and its current and potential end uses.