High Performance BGA Substrate

Another example of Mitsui Chemicals America's innovative approach to developing new products is the method of combining new materials with precise processing technology for ball grid array (BGA) packages.

Mitsui Chemicals' substrates have excellent performance such as low warpage and high heat resistance due to its high flexural modulus, low CTE and high Tg (300°).The company offers two types of substrates for integrated circuits.

BN300 Substrate for IC (Integrated Circuit)

BN300 BGA is a high heat resistant material developed by using Mitsui Chemicals' polymer technologies. The high performance BGA substrate furnishes high temperature performance, such as flexural strength, flexural modulus, barcol hardness and dimensional stability. An extremely reliable package, BN300 BGA, is suitable for a high pin count package.

BN300 Substrate Characteristics & Features

High Heat Resistant (Glass Transition Temperature - 300°C) Good High Temperature Performance (Flexural Modulus, CTE) Excellent Solder Heat Resistance Low Warpage High Reliability   View: BN300 BGA Substrate Characteristics Chart View: BN300 BGA Substrate Features Chart

(1.06MB) Download BN300 BGA Substrate Brochure

BN300 Substrate Applications

The BGA Substrate is designed for maximum flexibility and electrical performance and is featured in semiconductor applications such as:

	Substrate for Semiconductor Packaging Substrates for High Temperature Chip Bonding (Au/Au, Au/Sn) Large Scale Substrates Ultra Thin Substrates
	High Performance Printed Wiring Boards under high temperature environment Automotive Applications Burn-in Boards
	Flip chip package (High temperature solder process)
	High pin count package
	Thin package

Metal Substrate for Integrated Circuit (IC) Package

Metal ball grid array, which is produced by using Mitsui Chemicals' original thermoplastic polyimide as a dielectric, is an excellent heat dissipation substrate for integrated circuits with a unique cavity.

Additional information on the BN300 ball grid array's automotive applications is available on our automotive industry website. For more information on the company's BGA substrate line, please contact the manager.